The electronics industry is constantly growing, and with the ever-increasing need for communications and data transmission, high-performance materials are key to the success of the sector. Fluoropolymers play a crucial role in the industry due to their superior chemical resistance and inherent high purity, enabling improvements in functionality and reliability.

As the capabilities of semiconductor manufacture grow with time, components get smaller, presenting challenges for the materials of construction. For instance, the precise etching processes needed to construct chipset architecture on the nanometre scale utilises aggressive chemicals, and the tooling and components need to be able to withstand these environments for long periods of time.

The new 5G cellular network is expected to become widely used in the very near future. As the world evolves to realise its ambitions for ultimate connectivity, the demands for faster download speeds and lower latency require near-instantaneous system responsiveness, and therefore components need to be up to the task. Quality standards and performance specifications for components are becoming constantly more rigorous to ensure the speed and communication continuity expected of a 5G connected device. Developers across the globe are therefore working diligently to create the technology needed to support the ultra-fast network.

As a market leader in innovative fluoropolymer technology, AGC has developed Fluon+™ EA-2000 resin to aid the development of 5G-capable, high-frequency printed circuit boards. Fluon+™ EA-2000 is a variant of PFA (perfluoro alkoxy) that has been functionalised to include an adhesive group within the polymer backbone, allowing for superior adhesion to other materials. The rich carbon-fluorine chemistry of the polymer gives the material excellent electrical characteristics, heat and chemical resistance. EA-2000 can be applied in a single-step process without the need for surface treatment or a separate adhesive layer.

Since it possesses enhanced electrical characteristics, Fluon+™ EA-2000 is ideal for coating and protecting printed circuit boards (PCBs). Its low dielectric constant (2.1) and low dissipation factor (0.001), in combination with its excellent adhesive capabilities, enables EA-2000 to be used in thin layers in PCBs without sacrificing any signal performance, facilitating the development of lightweight components and structures.

Copper-clad laminate (CCL) is a material used in printed circuit boards for 5G applications with high-frequency bands. Both the use and production of CCL requires materials with low transmission losses. Using EA-2000 in printed circuit boards can reduce transmission losses by over 30% compared to existing materials.

To ensure the longevity of electronics, effective heat management is of paramount importance when considering materials for use in PCBs and other components of 5G antennae. EA-2000 can withstand continuous operating temperatures of up to 260°C so it can perform under the harshest conditions of a 5G-enabled device.

As with all fluoropolymers, EA-2000 also exhibits excellent non-stick properties, low friction coefficient, and superior water and oil repellency.

AGC is committed to contributing to the growth of next-generation, high-speed communication technology. To learn more about how Fluon+™ EA-2000 can help in your application, contact our team today.